Intel (INTC, Financials) and U.S.-based 3DGS will invest approximately $3.3 billion to build a semiconductor substrate manufacturing plant in India's Odisha state, marking another step in the country's effort to expand its chip industry.
The facility will be developed in the Bhubaneswar-Khurda region over the next five to six years and is expected to create more than 1,800 direct high-skilled jobs.
The plant will focus on advanced packaging glass-core substrates, high-density interconnect substrates and related semiconductor technologies. Substrates serve as the foundation on which semiconductor components are assembled, making them a critical part of the chip manufacturing process.
The announcement comes as India continues to offer billions of dollars in incentives aimed at attracting semiconductor investments and building a stronger domestic electronics supply chain.
For Intel, the project expands its manufacturing footprint in one of the world's fastest-growing technology markets while supporting broader efforts to diversify semiconductor production beyond traditional hubs.
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